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![Hi_0335_Final copy.jpg](https://static.wixstatic.com/media/482801_1e1cac9b4a064e79846f8199610ca92d~mv2.jpg/v1/fill/w_388,h_259,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/482801_1e1cac9b4a064e79846f8199610ca92d~mv2.jpg)
Semiconductor
Packages
Ceramic IC Packages
Metal Can Type
Transistor outline (TO) Packages
Prototype Packages
SEMICONDUCTOR
SEMI ASSEMBLY
Semiconductor
Packages
Wafer sawing
Plasma Cleaning
Die attatch
AL Wire bonding
AU Wire bonding
Die-shear & Wire-pull
Molding
Welding
Laser Marking
![Hi_0232.jpg](https://static.wixstatic.com/media/482801_d1c453fb50df49b29e8f63035e56db6e~mv2.jpg/v1/fill/w_388,h_259,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/482801_d1c453fb50df49b29e8f63035e56db6e~mv2.jpg)
Materials
![스크린샷 2021-02-16 오후 7.32.58.png](https://static.wixstatic.com/media/482801_0c38b9baa45f4882947454ae913e2d40~mv2.png/v1/fill/w_388,h_206,al_c,q_85,usm_0.66_1.00_0.01,enc_avif,quality_auto/482801_0c38b9baa45f4882947454ae913e2d40~mv2.png)
Material
BLU /
Injection Molding
![Tech_0014_final.jpg](https://static.wixstatic.com/media/482801_2bb3225a78e64ea59b1dd83d58639dc3~mv2.jpg/v1/fill/w_388,h_259,al_c,q_80,usm_0.66_1.00_0.01,enc_avif,quality_auto/482801_2bb3225a78e64ea59b1dd83d58639dc3~mv2.jpg)
INJECTION MOLDING
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